Interesting video about 7nm Chinese chips. <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US. Even though it got banned by the US.
It is also reported by the register <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
--
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~
On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:lower costs.
Interesting video about 7nm Chinese chips. <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US.
Even though it got banned by the US.
It is also reported by the register <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
--A related article on China's advancement in chip making and chip making machinery.
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~
"How China could leapfrog US chip-making bans:
US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
...
China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably
The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
I suspect the 2021 domestic produced figure of 17% is an underestimation given the
very restrictive ban against importing chip to China.
On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
Interesting video about 7nm Chinese chips. <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US.
Even though it got banned by the US.
It is also reported by the register <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
--A related article on China's advancement in chip making and chip making machinery.
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~
"How China could leapfrog US chip-making bans:
US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
...lower costs.
China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably
The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
I suspect the 2021 domestic produced figure of 17% is an underestimation given the
very restrictive ban against importing chip to China.
On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:lower costs.
On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
Interesting video about 7nm Chinese chips. <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US.
Even though it got banned by the US.
It is also reported by the register <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
More on 'advanced packaging'.--A related article on China's advancement in chip making and chip making machinery.
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~
"How China could leapfrog US chip-making bans:
US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
"If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
hardly qualify as “micro” anymore.
One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
stacked on top of each other.
...
Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
covered in wires, that connects it to the rest of a device.
In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
to another one doing general-purpose computations, and the connection between them is something literally called
a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
...
The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
“chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
creating many short, direct connections—often forged from the same silicon that the chips themselves are made
from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
Direct communication between the different chiplets that together make up a megachip is what allows them to
function like a single, giant microprocessor, ..." https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
...
China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably
The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
I suspect the 2021 domestic produced figure of 17% is an underestimation given the
very restrictive ban against importing chip to China.
On Saturday, July 30, 2022 at 8:13:39 PM UTC+8, ltlee1 wrote:considerably lower costs.
On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
Interesting video about 7nm Chinese chips. <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US.
Even though it got banned by the US.
It is also reported by the register <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
More on 'advanced packaging'.--A related article on China's advancement in chip making and chip making machinery.
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~
"How China could leapfrog US chip-making bans:
US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
"If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
hardly qualify as “micro” anymore.
One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
stacked on top of each other.
...
Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
covered in wires, that connects it to the rest of a device.
In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
to another one doing general-purpose computations, and the connection between them is something literally called
a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
...
The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
“chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
creating many short, direct connections—often forged from the same silicon that the chips themselves are made
from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
Direct communication between the different chiplets that together make up a megachip is what allows them to
function like a single, giant microprocessor, ..." https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
...
China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at
lithographic circuitries to pass through them that can short circuit and bring the cost very high to replace rather than the cost of being cheap because of the fine lines of lithography by very fine laser etching of circuity packaging. Thus new machineThe Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
That right, the new ways of doing things and producing more efficient outcomes are by direct circuitries that stacked on top of each other that each can be removed, readapted, reused, and exchanged. It is not in the current ways of very fine lines ofI suspect the 2021 domestic produced figure of 17% is an underestimation given the
very restrictive ban against importing chip to China.
On Saturday, July 30, 2022 at 12:54:26 PM UTC-4, stoney wrote:considerably lower costs.
On Saturday, July 30, 2022 at 8:13:39 PM UTC+8, ltlee1 wrote:
On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
Interesting video about 7nm Chinese chips. <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US.
Even though it got banned by the US.
It is also reported by the register <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
More on 'advanced packaging'.--A related article on China's advancement in chip making and chip making machinery.
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~
"How China could leapfrog US chip-making bans:
US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
"If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
hardly qualify as “micro” anymore.
One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
stacked on top of each other.
...
Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
covered in wires, that connects it to the rest of a device.
In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
to another one doing general-purpose computations, and the connection between them is something literally called
a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
...
The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
“chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
creating many short, direct connections—often forged from the same silicon that the chips themselves are made
from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
Direct communication between the different chiplets that together make up a megachip is what allows them to
function like a single, giant microprocessor, ..." https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
...
China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at
lithographic circuitries to pass through them that can short circuit and bring the cost very high to replace rather than the cost of being cheap because of the fine lines of lithography by very fine laser etching of circuity packaging. Thus new machineThe Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
That right, the new ways of doing things and producing more efficient outcomes are by direct circuitries that stacked on top of each other that each can be removed, readapted, reused, and exchanged. It is not in the current ways of very fine lines ofI suspect the 2021 domestic produced figure of 17% is an underestimation given the
very restrictive ban against importing chip to China.
For some reason, many in the West wrongly believe that technological innovation
depends on their so called "free speech" and "free press." In reality, innovation is
often created through market. A natural result of supply and demand. Large market
is naturally more innovative because of economies of scale and scopes. For the US,
one of its problem is that companies such as INTEL are spending more effort in
lawfare than in innovation. Else, TSMC could not possibly overtake INTEL technologically.
The US government passed the Wolf Amendment 10 years ago and the CHIPS Act more recently. This approach to contain China is likely to fail similarly.
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